KMQX60013A: Complete Guide to Samsung’s 32GB eMMC + 2GB LPDDR3 eMCP Memory Chip

KMQX60013A is a highly integrated embedded memory chip from Samsung for mobile devices, smart devices, tablets, computers, car electronics, industrial applications, IoT devices and a wide range of other embedded systems. This eMCP, with eMMC 5.1 32 GB flash and LPDDR3 RAM 2 GB all integrated in one chip, makes boards much smaller and the system works much faster. With smart device technologies rapidly getting smaller and smarter, electronic devices are always getting thinner and flatter.

For electronics engineers working to design innovative solutions, making the hardware as small as possible is a critical challenge.

Therefore, for replacing smart device storage or design custom electronics devices, integrated memory packages such as the KMQX60013A-B419 are extremely popular. Instead of implementing separate flash and RAM chips on the mainboard, Samsung has combined these components into a single small device to minimize board footprint and reduce production cost. This article aims to guide you through the detailed information of the KMQX60013A including the specification, architecture, typical use cases, benefits and compares it with another similar product. Whether you are replacing the memory of a phone, prototyping an electronics product, sourcing for spare parts or learning about Samsung memory ICs, this article has got you covered.

What is KMQX60013A?

Samsung KMQX60013A-B419 -Embedded Multi-Chip Package (eMCP) eMCP is two in one package device having following components integrated inside:

• 32 GB eMMC 5.1 Flash Storage
• 16 Gb (2 GB) LPDDR3 Mobile DRAM

Such integration can significantly save on the complexity of the motherboard and at the same time ensure good storage performance, along with the dependable bandwidth of the memory. The chip in a space saving 221-ball FBGA package is also suitable for tiny electronics where very little PCB space is available. Being integrated into a chip also reduces routing and power savings compared to an external memory component.

Overview of Samsung KMQX60013A

Understanding eMCP Technology

An Embedded Multi-Chip Package (eMCP) is the integration of various technologies of silicon die into a physical device in a semiconductor packaging style.

Instead of installing:

• one storage chip
• one RAM chip

manufacturers install only one eMCP package.

The KMQX60013A combines:

• eMMC flash memory
• LPDDR3 DRAM

There are a number of engineering benefits to using this solution. The LPDDR3 memory will be the processor’s main working temporary RAM, whereas the storage will be where operating systems, apps, firmware, images, and movies will reside. Since both the storage and the LPDDR3 memory are integrated into a single package, board design simplifies and signal routing becomes shorter.

Key Technical Specifications

Storage Performance

Reliable Embedded Flash Storage Integrated 32GB eMMC 5.1 for modern operating systems and applications.

Compared to older eMMC generations, eMMC 5.1 offers:

• Faster sequential read speeds
• Improved write performance
• Better command queuing
• Enhanced reliability
• Lower latency
• Improved power management

This helps in smooth loading of apps, reduces the boot-up times, and improves multitasking abilities. While this eMMC technology doesn’t match the speed of new UFS based devices but can still be ideal for entry-level smartphone, industrial controllers, tablets for education, and in embed devices where price and reliability are key.

LPDDR3 Memory Performance

2 GB LPDDR3 RAM on board provides 1866 Mbps speeds, which have adequate bandwidth to:

• Android operating systems
• Embedded Linux
• Consumer electronics
• Smart displays
• POS terminals
• IoT gateways

The idea of LPDDR3 is to offer low power consumptions while still good performance to mobile processors. Low Voltage it provides longer battery life on the mobile devices.

Advantages of Integrated eMCP Architecture

It’s easier for the hardware designer to just go ahead and just do it like it is if you can go ahead and use the KMQX60013A than the two discrete chips for memory.

• Space Saving: One package replaces two independent chips, freeing PCB space for additional components.
• Lower Manufacturing Cost: Assembly becomes simpler because fewer components must be placed during production.
• Improved Reliability: Shorter electrical paths reduce interference and improve signal stability.
• Lower Power Consumption: Integrated memory packages typically require less power than separate memory implementations.
• Faster Development: Hardware layout becomes simpler, reducing PCB routing complexity.
• Compact Product Design: Manufacturers can create thinner smartphones and smaller embedded devices.

Common Applications

The KMQX60013A-B419 is suitable for numerous embedded products.

Why Manufacturers Choose KMQX60013A

Many OEMs Select the KMQX60013A OEMs frequently opt for the KMQX60013A as it offers a good balance of performance, power consumption and cost. Manufacturers don’t need to deal with numerous suppliers, as Samsung has designed and qualified a memory solution that guarantees the effective interaction between RAM and storage. This saves manufacturers a great amount of design validation effort, thereby decreasing development time and accelerating time to market. Furthermore, the broad range of industrial applications can benefit from the extensive industry know-how that Samsung has developed over its many years in chip making to guarantee consistent quality and availability.

Comparison with Separate Memory Chips

Benefits for Embedded System Designers

Embedded engineers often work within strict space and power limitations.

The KMQX60013A addresses these challenges by delivering:

• Reduced board area
• Simplified memory routing
• Lower thermal output
• Reliable long-term operation
• High integration
• Lower BOM (Bill of Materials)
• Better manufacturing efficiency

Integrated memory devices help alleviate hardware cost while giving industrial electronics systems years of stable, long term operation.

Package Design

The chip uses a 221-ball Fine Ball Grid Array (FBGA) package.

FBGA packaging offers several benefits:

Performance Considerations

The KMQX60013A provides stable and reliable performance for a lot of use cases, but it is good to know how it is positioned. Onboard storage. The integrated eMMC 5.1 storage will be perfectly fine in mainstream device, but is less capable of speed compared to the latest UFS(Universal Flash Storage) technology that is featured in high-end phones.

The LPDDR3 offers decent memory bandwidth, making it sufficient in entry level and mid range system, but not in high performance ones that now support LPDDR4 and LPDDR5. This makes the KMQX60013A ideal in products, in which cost, energy consumption, and guaranteed reliability over top-of-the-line speed is paramount.

Reliability and Samsung Manufacturing Quality

Samsung one of the world’s leading chip-makers Samsung’s eMCPs are well-known for:

• High manufacturing quality
• Consistent performance
• Long product lifecycle
• Low failure rates
• Strong quality control
• Broad industry adoption

These factors result in theKMQX60013A as a reliable selection for both commercial and industrial environments.

Who Should Use KMQX60013A?

The KMQX60013A is an ideal memory solution for:

• Smartphone manufacturers
• Tablet OEMs
• Embedded system designers
• IoT device developers
• Automotive electronics engineers
• Medical equipment manufacturers
• Industrial automation companies
• Repair professionals seeking compatible replacement memory components

With an all-inclusive architecture that makes the design of its hardware easy to develop and provides a sufficient range of memory performance for diverse use cases, it offers a comprehensive solution to the wide array of application challenges you’re likely to encounter.

Conclusion

The KMQX60013A-B419 is an efficient and cost-effective memory solution for small form factor electronics requiring storage, performance and form factor constraints to be balanced. Samsung achieved a storage of 32 GB of eMMC 5.1 memory integrated with 2 GB of LPDDR3 DRAM in a single 221-ball FBGA package, allowing OEM manufacturers to reduce the bill of materials and optimize their printed circuit board (PCB) design, thereby decreasing total cost without compromising performance.

The KMQX60013A is still widely applicable in budget smart phones and tablets, industrial controls, IoT gateways, car information entertainment (IVI), and other embedded applications, even though new standards such as UFS, LPDDR4/LPDDR5 are now featured in the latest high-end products. Its stability, affordability and compact footprint make it suitable for engineers, and OEM makers seeking an established and affordable eMCP solution from a trusted manufacturer.

Also Read: KMQE60013M: Complete Guide to Samsung’s Embedded Multi-Chip Package (eMCP)