KMQE10013M: Complete Guide to Samsung KMQE10013M-B318 eMCP Memory Chip

Introduction

The KMQE10013M-B318 is a high-performance eMCP (embedded Multi-Chip Package) solution from Samsung which has been designed for usage in mobile phones, tablet PCs, industrial products, IoT devices and various other embedded applications. Combining 16GB of eMMC 5.1 storage with 16Gb (2GB) of LPDDR3 Mobile DRAM within one package, this Samsung part can save space on printed circuit boards (PCBs), minimize system design complexities, and enhances the reliability of electronic devices. Increasing consumer demand for thinner and more potent electronic devices has also fueled manufacturers to use integrated memory devices instead of disparate DRAM and NAND.

The Samsung KMQE10013M-B318 addresses these needs by providing swift storage access, efficient memory access performance, and minimal power consumption in a tiny 221-pin FBGA form factor.

If you need to understand the Samsung KMQE10013M’s specifications for any application, from embedded system design to the replacement of a motherboard or smartphone chip, then keep reading!

What is the KMQE10013M?

Embedded Multi-Chip Package (eMCP) memory. The KMQE10013M-B318 is an eMCP which is an integrated semiconductor package that merges two key memories together:

• 16 GB eMMC 5.1 Flash Storage
• 16 Gb (2 GB) LPDDR3 Mobile DRAM

Instead of needing to accommodate both separate storage and memory chips on the motherboard, the eMCP puts both in the same physical package. This simplifies motherboard construction considerably, as well as benefiting electricity delivery and reducing manufacturing costs.

The KMQE10013M is particularly popular in:

• Android smartphones
• Tablets
• Smart home devices
• POS terminals
• Industrial controllers
• Automotive infotainment systems
• IoT gateways
• Embedded Linux systems

The balance between system and storage is ideal for lower to mid range embeded products.

Samsung KMQE10013M-B318 Specifications

Understanding eMCP Technology

Embedded Multi-Chip Package technology combines both volatile and non-volatile memory within a single semiconductor package.

The KMQE10013M contains:

• LPDDR3 memory for temporary system operations
• eMMC storage for permanent operating system and user data

This integration provides several engineering advantages:

• Reduced PCB size
• Lower manufacturing cost
• Simplified routing
• Improved signal integrity
• Lower power consumption
• Higher production reliability

Instead of installing two separate chips for memory, the motherboards just install one package.

Memory Architecture

Two different memory techniques form the basis of the Samsung KMQE10013M working in conjunction.

eMMC 5.1 Storage Features

In addition, the internal flash storage complies with the eMMC 5.1 specification, providing an increase in read speed.

Major features include:

• Faster sequential read speeds
• Improved random read/write performance
• Command Queue (CQ)
• Better error correction
• Enhanced reliability
• Boot partition support
• Secure erase functions
• Replay Protected Memory Block (RPMB)

TheKMQE10013M’s combination of characteristics suits them for use in Android-based operating systems and on embedded Linux systems, where reliable data storage is essential.

LPDDR3 Memory Performance

The onboard 16 Gb LPDDR3 memory allows for 2 GB of system memory, a common amount for many embedded and mobile compute systems.

Benefits include:

• Low operating voltage
• Reduced heat generation
• High bandwidth
• Stable multitasking performance
• Lower standby power
• Efficient mobile operation

The cost effective LPDDR3 technology is the ubiquitous solution for many embedded applications. And it hits the sweet spot between cost, performance and power efficiency.

Key Features of KMQE10013M

Advantages of Using KMQE10013M

Product Development eased with Reliable Performance Manufacturers choose the Samsung KMQE10013M because product development and guaranteed performance are made easy.

• Space Saving: Combining storage and RAM into one package significantly reduces motherboard size.
• Lower Manufacturing Cost: Using one package instead of two lowers assembly complexity and production expenses.
• Improved Reliability: Fewer solder joints reduce the chance of hardware failure over the product’s lifetime.
• Better Signal Integrity: Shorter internal connections improve communication between memory components.
• Power Efficiency: Designed specifically for mobile electronics, the chip minimizes energy consumption.
• Simplified PCB Design: Engineers require fewer traces and routing layers, resulting in cleaner board layouts.

Typical Applications

The Samsung KMQE10013M is suitable for numerous electronic products.

Package Information

The KMQE10013M uses a 221-ball Fine Pitch Ball Grid Array (FBGA) package.

This package provides:

• Excellent thermal performance
• High pin density
• Compact footprint
• Reliable solder connections
• Compatibility with automated SMT assembly

The FBGA package is commonly used in smartphones and compact embedded electronics where board space is limited.

Benefits for Embedded System Designers

Hardware engineers will find the KMQE10013M provides a good trade-off between integration and performance. Designers using a single eMCP, rather than discrete DRAM and NAND components, can minimize the development time and bill of material (BOM), and realize greater production yields. Its integrated design helps accelerate firmware development as well, due to a standardized memory subsystem that readily supports Android, Linux and embedded OS.

Comparison with Separate Memory Chips

Why Samsung eMCP Solutions Are Popular

As a top global semiconductor vendor, Samsung’s eMCP solutions are widely chosen due to their excellent quality, stable performance and sustained reliability. This expertise is also reflected in the new Samsung KMQE10013M-B318 solution that couples mature LPDDR3 memory with highly reliable eMMC 5.1 storage in a single, slim package. This combination provides superior power efficiency, steady performance and easy board design, allowing OEM customers to create highly cost-effective mobile and embedded products.

Conclusion

Samsung’s KMQE10013M-B318 offers a 16 GB eMMC 5.1 storage coupled with 16 Gb (2 GB) LPDDR3 Mobile DRAM inside a compact 221-ball FBGA package, thus decreasing PCB space requirements, decreasing costs in the production process, and increasing system reliability. Samsung has successfully manufactured an eMCP that can be utilized for the latest smartphones, tablets, and other connected products such as the Internet of Things (IoT), as well as within industrial control units and embedded products.

Balancing storage density, performance, and power consumption, the KMQE10013M can be a cost effective solution for all-in-one memory for your products whether developing new designs or in repair and replacement projects.

Also Read: H9TQ52ACLTMC: Complete Guide to the SK Hynix eMCP Memory Chip